Colloidal Silica & CMP

Colloidal silica is used in Chemical Mechanical Polishing (CMP) for metallographic sample preparation. It consists of fine silica particles in a liquid suspension, providing effective material removal and smooth, defect-free surfaces. Ideal for final polishing steps, it is suitable for various materials, including metals, ceramics, and composites. Colloidal silica combines chemical action with mechanical abrasion to achieve high-quality, scratch-free finishes.