Wafering Blades

Wafering blades are used in metallographic sample preparation for precise cutting and sectioning of materials. These thin, high-precision blades are designed to produce clean and accurate cuts with minimal damage to the sample. Made from materials such as diamond or silicon carbide, wafering blades are suitable for a wide range of materials, including metals, ceramics, and composites. They come in various sizes and specifications to accommodate different cutting needs and ensure high-quality sample preparation.

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Metallographic Equipment

Pace Technologies provides a comprehensive range of metallography equipment, including cutting, mounting, grinding, and polishing solutions to meet all your material analysis needs.