Wafering Blades

Wafering blades are used in metallographic sample preparation for precise cutting and sectioning of materials. These thin, high-precision blades are designed to produce clean and accurate cuts with minimal damage to the sample. Made from materials such as diamond or silicon carbide, wafering blades are suitable for a wide range of materials, including metals, ceramics, and composites. They come in various sizes and specifications to accommodate different cutting needs and ensure high-quality sample preparation.